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Apple files a Continuation Patent in Europe that Presents a Major Update to their PrimeSense 3D Scanning Invention

1 Fx Cover 3D scanner patent - Patently Apple IP Report

 

Apple filed a continuation patent in Europe on Thursday that covers a major update to a key PrimeSense invention regarding 3D scanning and projection. PrimeSense, which Apple acquired in late 2013, originally filed this patent in February 2013. Apple was granted this patent in Q1 2018. In 2019 Apple was granted another patent for this invention and we noted at the time that the patent claims were updated to include the use of a laser.

 

Apple's PrimeSense team in Israel have updated the technology relating to this invention that could be used for short range scanning for Face ID and also for scanning images that require further distances as shown in our cover graphic. Here the scanner is scanning a much larger scene and yet can collectively scan people face and more.

 

As noted earlier, Apple's 2019 granted patent introduced the use of a laser in its patent claims and in yesterday's continuation patent "laser" has been clarified as being vertical-cavity surface-emitting lasers (VCSELs). 

 

A continuation patent always means that the company is adding new aspects to their invention and in this case Apple is adding 20 new claims with one of the main themes being the use of VCSELs as presented below:

 

  1. A beam generating device, comprising: a semiconductor substrate, having an optical passband; a first array of vertical-cavity surface-emitting lasers (VCSELs), which are formed on a first face of the semiconductor substrate and are configured to emit respective laser beams through the substrate at a wavelength within the passband; and a second array of microlenses, which are formed on a second face of the semiconductor substrate in respective alignment with the VCSELs so as to transmit the laser beams generated by the VCSELs, wherein the VCSELs are configured to be driven to emit the laser beams in predefined groups in order to change a characteristic of the laser beams.

 

  1. The device according to claim 1, wherein the groups of the VCSELs are selected so that the device outputs beams of different diameters depending upon the group of the VCSELs that is driven.

 

  1. The device according to claim 1, wherein at least some of the microlenses are offset relative to the VCSELs so as to control an angle of transmission of the respective laser beams.
  2. The device according to claim 3, wherein the at least some of the microlenses are offset inwardly relative to the VCSELs, so as to cause the respective laser beams to converge together.

 

  1. The device according to claim 1, wherein the substrate comprises GaAs.

 

  1. The device according to claim 1, wherein the semiconductor substrate has a thickness of 0.5 mm, and is transparent to wavelengths longer than 900 nm.

 

  1. The device according to claim 1, and comprising a lens, which is configured to collect the beams transmitted through the microlenses and direct the beams toward a target.

 

  1. The device according to claim 1, wherein the first and second arrays are configured in a hexagonal arrangement.

 

  1. An optoelectronic module, comprising: a micro-optical substrate; a beam transmitter, mounted on the micro-optical substrate, and comprising: a semiconductor substrate, having an optical passband; a first array of surface-emitting devices, which are formed on a first face of the semiconductor substrate and are configured to emit respective laser beams through the substrate at a wavelength within the passband; and a second array of microlenses, which are formed on a second face of the semiconductor substrate in respective alignment with the surface-emitting devices so as to transmit the laser beams generated by the surface-emitting devices along a beam axis, wherein the surface-emitting devices are configured to be driven to emit the beams in predefined groups in order to change a characteristic of the beams; and a receiver, comprising a detector die mounted on the micro-optical substrate and configured to sense light received by the module along a collection axis of the receiver.

 

  1. The module according to claim 9, wherein the groups of the surface-emitting devices are selected so that the transmitter outputs beams of different diameters depending upon the group of the surface-emitting devices that is driven.

 

  1. The module according to claim 9, wherein at least some of the microlenses are offset relative to the surface-emitting devices so as to control an angle of transmission of the respective beams.

 

  1. The module according to claim 11, wherein the at least some of the microlenses are offset inwardly relative to the surface-emitting devices, so as to cause the respective beams to converge together.

 

  1. The module according to claim 9, and comprising beam-combining optics, which are configured to direct the beams and the received light so that the beam axis is aligned with the collection axis outside the module.

 

  1. The module according to claim 13, wherein the beam-combining optics comprise a beamsplitter, which is intercepted by both the beam axis and the collection axis.

 

  1. The module according to claim 9, wherein the laser beams and the received light are directed to impinge on a scanning mirror, wherein the mirror scans both the laser beams and a field of view of the receiver over a scene.

 

    16.The module according to claim 9, wherein the surface-emitting devices comprise vertical-cavity surface-emitting lasers (VCSELs).

 

  1. The module according to claim 9, wherein the receiver comprises an avalanche photodiode.

 

  1. The module according to claim 9, wherein the receiver comprises a two-dimensional matrix of photodetectors.

 

  1. The module according to claim 9, wherein the semiconductor substrate comprises GaAs.

 

  1. The module according to claim 9, wherein the semiconductor substrate has a thickness of 0.5 mm, and is transparent to wavelengths longer than 900 nm.

 

As a reminder to those unfamiliar with PrimeSense, Microsoft adopted PrimeSense technology in their Microsoft's Xbox 360 consisting of an infrared projector and camera and a special microchip that generates a grid from which the location of a nearby object in 3 dimensions can be ascertained. So PrimeSense 3D scanning technology isn't a theory but rather an established proven technology that is constantly being improved upon.

 

Apple's VCSEL supplier Finisar was acquired by company called II-VI in 2018. Prior to the acquisition, Finisar's VP and GM pointed to three key markets for VCSELs going forward: self-driving cars, gesture and facial recognition. The video in our report was pulled by the new merged company.  

 

Later this year we'll begin to see 3D camera modules by Sony being incorporated into a number of premium smartphones for the purpose of introducing gesture recognition. The advanced PrimeSense scanner that can go beyond the distance for face recognition could be used for the future gesture recognition applications on iPhones.

 

10.51XF - Continuation Patent Report Bar

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