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In an Effort to Catch-up with TSMC, Samsung Expands their Collaboration with ARM

1 samsung foundry forum

 

Samsung Electronics announced that it will expand collaboration with UK-based semiconductor intellectual property firm Arm to 7 and 5-nanometer FinFET process technology for high-performance computing at a foundry forum held in Seoul on Thursday.

 

The enhanced collaboration with Arm is part of the memory chip giant's efforts to strengthen its foundry business by providing better solutions for its fabless customers.

 

On 7-nm Low Power Plus and 5-nm Low Power Early process technologies, Samsung will provide Arm's Arm Artisan physical IP platform that will enable 3-gigahertz computing performance for high-end system on chips.

 

Ryan Sanghyun Lee, vice president of foundry marketing at Samsung stated that "Collaboration with Arm in the fields of IP solutions is crucial in increasing high-performance computing power and accelerating the growth of artificial intelligence and machine learning capabilities."

 

Samsung's 7LPP process technology will be ready for its initial production in the second half of 2018. The first extreme ultra violet (EUV) lithography process technology, and its key IPs, are in development and expected to be completed by the first half of 2019. Samsung's 5LPE technology will allow greater area scaling and ultra-low power benefits due to the latest innovations in 7LPP process technology.

 

The Arm Artisan physical IP platform for Samsung's 7LPP and 5LPE includes HD logic architecture, a comprehensive suite of memory compilers, and 1.8V and 3.3V GPIO libraries. In addition, for Samsung's 7LPP and 5LPE process technologies, Arm will provide Artisan POP IP solutions on its latest processor cores featuring Arm DynamIQ technology. Arm's POP IP solution is a core-hardening acceleration technology to enable the best Arm processor implementations and the most rapid time-to-market.

 

Details of the recent updates to Samsung's Foundry roadmap, from 7nm EUV development to 3GAAE (3nm Gate-All-Around Early) technology, and top-notch design enablement solutions were presented at Samsung Foundry Forum 2018 Korea on July 5, 2018, in Seoul.

 

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