Apple to reportedly use 3 Korean Flexible Printed Circuit Board Suppliers for iPhone 8 and Shift all iPhones to OLED in 2019
In early February Patently Apple posted a report titled "Apple Reportedly Contracts new Korean Supplier for Next-Gen OLEDs with Embedded Multitouch Technology." Today it's being reported that Interflex and Samsung Electro-Mechanics are beefing up production of flexible printed circuit boards (or FPCBs) for Apple's upcoming iPhone 8, the first iPhone to adopt organic light-emitting diode screens.
The Bell, who broke the first story about Interflex being a new Apple supplier, now reports today that Interflex plans a new production facility to handle Apple's work later this year that will cost US$866 million.
"FPCB connects chips to parts such as displays and cameras. Apple will secure the part for its new OLED iPhone from three Korean suppliers, including the Samsung unit, Interflex and BH.
Apple is expected to adopt OLED for about 60 million units or 40 percent of the iPhone 8 this year and double the adoption next year. It aims to use OLED for all its new iPhones by 2019."
Orders for each supplier will be decided when the production starts in April or May.
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