Apple has recently added Chipbond Technology and MJC Probe (MPI) as new supply chain players related to the 2017 iPhone. The two Taiwan-based companies have both entered Apple's supply chain by working with TSMC. MPI provides probe cards for TSMC's wafer testing, while Chipbond will be engaged in the driver-IC backend services, the sources said.

While it's been previously reported that TSMC has obtained orders for Apple's A11 processor that will power next year's top-end iPhones and tablets, it's now being reported that TSMC will also offer its backend integrated fan-out (InFO) wafer-level packaging (WLP) technology for the 10nm A11 chips beating Amkor Technology and other backend specialists.

In another win, TSMC has been reportedly contracted to manufacture OLED driver ICs for Apple. Although Apple's 2017 iPhones are set to feature OLED panels primarily supplied by Samsung, supply chain sources claim that Apple will use in-house developed OLED driver ICs.

Previous Taiwanese supply chain reports have quoted industry sources as saying Apple is internally developing touch and display driver integration (TDDI) single-chip solutions for its future iPhones. To date Synaptics has been the sole supplier of driver ICs for iPhones.

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