Apple will reportedly be among the First to Adopt TSMC's Integrated Fan-Out (InFO) WLP Technology in 2016
Earlier this month we posted a report titled "HSBC Analysts Predict TSMC will Gain All of Apple's A10 Chip Business," wherein we noted that Barron's Asia noted that TSMC could regain 100% (or the majority) of Apple's A10 Production in 2016 that will include InFO technology. Today more news has surfaced supporting that earlier report. The Chinese-language Commercial Times cited a Goldman Sachs analyst as saying in a recent report that TSMC is scheduled to move its integrated fan-out (InFO) wafer-level packaging technology to volume production in the second quarter of 2016 and that Apple would be among the first wave of TSMC customers to adopting this technology.
TSMC will have 85,000-100,000 wafers fabricated with the foundry's in-house developed InFO packaging technology in the second quarter of 2016, the report quoted Goldman Sachs analyst Donald Lu as estimating.
TSMC has disclosed its InFO packaging technology will be ready for mass production in 2016. Company president and co-CEO CC Wei remarked at an October 15 investors meeting that TSMC has completed construction of a new facility in Longtan, northern Taiwan. TSMC's InFO technology will be ready for volume production in the second quarter of 2016, according to Wei.
The IEEE digital library describes InFO-WLP this way: "For the first time, radio frequency (RF) circuits with InFO-WLP have been fabricated to illustrate how the high Q inductor can be used to dramatically improve performance and power consumption concurrently." Japan's i-Micronews adds that InFO-WLP "will enable high-definition video streaming and fast file transfer applications," which could be very appealing to Apple if they wish to bring Apple TV to the iPhone as a streaming TV service over the next several years.