Late last year Apple's all-new Mac Pro tower was revealed with a wildly advanced design. One year later and everything you wanted to know about the new Mac Pro is revealed in a series of six patent applications. Report updated 8:25am MST
The U.S. Patent and Trademark Office published a series of six patent applications that reveal various aspects of Apple's new Mac Pro computer design. There are hundreds of images that you could review and details galore in the following patent applications:
Computer Internal Architecture
Apple's Patent Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU). For more informatioin on the Mac Pro's internal architecture you can review patent applications 20140361671 and 20140362576
Computer Housing
Apple's Patent Abstract: A desktop computing system having at least a central core surrounded by housing having a shape that defines a volume in which the central core resides is described. The housing includes a first opening and a second opening axially displaced from the first opening. The first opening having a size and shape in accordance with an amount of airflow used as a heat transfer medium for cooling internal components, the second opening defined by a lip that engages a portion of the airflow in such a way that at least some of the heat transferred to the air flow from the internal components is passed to the housing. For more information on the Computer Housing of the Mac Pro, review these patent applications: 20140361672 and 20140362519.
Computer Thermal System
Apple's Patent Abstract:The present application describes various embodiments regarding systems and methods for providing efficient heat rejection for a lightweight and durable compact computing system having a small form factor. The compact computing system can take the form of a desktop computer. The desktop computer can include a monolithic top case having an integrated support system formed therein, the integrated support system providing structural support that distributes applied loads through the top case preventing warping and bowing. A mixed flow fan is utilized to efficiently pull cooling air through the compact computing system. For more information on the Mac Pro's thermal system you could review patent applications 20140362522 and 20140362523.
Updated at 8:25am: A Seventh Mac Pro Patent was discovered:
Computer Input/Output Interface
Apple's Patent Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU). For more information on Mac Pro's input/output interface see patent application 20140361893
Patently Apple presents a detailed summary of patent applications with associated graphics for journalistic news purposes as each such patent application is revealed by the U.S. Patent & Trade Office. Readers are cautioned that the full text of any patent application should be read in its entirety for full and accurate details. About Making Comments on our Site: Patently Apple reserves the right to post, dismiss or edit any comments. Comments are reviewed daily from 4am to 8pm MST and sporadically over the weekend.
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