Taiwan Semiconductor Manufacturing Company (TSMC) is expected to start making an integrated AP/GPU solution for Apple, using 20nm SoC process technology, according to DigiTimes Research analyst Nobunaga Chai. Initially, TSMC is working on engineering samples of Apple's new 28nm A6X which will power Apple's next-generation iPad and iPad mini devices, which will be launched around the middle of 2013. The big news however, is that TSMC is reportedly securing its first chip orders from Apple that will use TSMC's 16nm FinFET process that could play a key role in Apple's "breakthrough" product due out sometime between late 2013 and 2014. The report didn't verify as to what this mysterious breatkthrough product could be.