According to a supply chain report this morning, Nvidia's AI chips are expected to be mass-produced at TSMC's plant in Arizona, USA, by the end of this year. Analysts have pointed out that with orders pouring in from a number of US technology giants including Nvidia, Apple, Qualcomm, AMD and Broadcom, TSMC's Arizona plant will soon be able to operate at full capacity. At the same time, there are reports that TSMC's advanced 2nm process yield for storage products has exceeded 90% .

Sources revealed that Apple is still the largest customer of TSMC's Arizona plant and they will be the first company to get chips from the plant." Currently, TSMC is mass-producing N4 process chips at the plant, which corresponds to the 5nm and 4nm processes on the market. Nvidia's AI chips are currently in the process verification stage at the US plant and are expected to be put into mass production by the end of this year.

As demand for the Arizona plant soars, there are rumors in the industry that the plant may raise chip prices by up to 30%. Industry insiders analyzed that this is due to both the "higher manufacturing costs in the United States" and the "high capacity utilization of the plant." It is reported that the plant currently produces 15,000 12-inch wafers per month, and will expand production to 24,000 per month in the future, reaching the peak design capacity.

From another report we are provided with the full text of the letter sent by TSMC’S subsidiary to the U.S. Department of Commerce written by TSMC’s TC Morris Cheng, the founder of TSMC.

In  the report we learn that TSMC will start building its third wafer fab in 2025. It will initially adopt 2nm process, and later A16 process, and will be equipped with TSMC's first-class backside power supply solution Super Power Rail.

in addition to the front-end fab, TSMC also plans to build two new advanced packaging facilities in Arizona. Their first advanced packaging investment is a realization of 3DFabric’s strategy in the U.S., further ensuring that the most critical and innovative manufacturing processes are carried out in the U.S.

The full text of TSMC's new U.S. plant subsidiary's letter to the Ministry of Commerce' Bureau of Industry and Security (BIS) could be found in the UDN report here.