WMCM (Wafer-Level Multi-Chip Module) is a chip packaging technology that allows multiple dies—such as a CPU, GPU, and memory—to be integrated into a single compact package. Unlike traditional InFo (Integrated Fan-Out) packaging, which focuses on single-die integration, WMCM enables more flexibility in combining different components while maintaining a small footprint.This shift will allow Apple to create more powerful and efficient chip designs, potentially improving performance, thermal management, and battery life.

While it's been rumored that Apple will be adopting WMCM packaging for its A20 chip in next year’s iPhone 18, moving away from InFo packaging, today there's positive news on that front. It's being reported today in Taiwan that TSMC is currently developing WMCM packaging at its Zhunan plant with its Longtan plant also conducting small-scale trial production. Actual mass production will take place at Chiayi plant P1 (Phase 1 plant). Construction of the Mini Line small-scale mass production line at Chiayi plant P1 will start in the fourth quarter of this year.