In July 2024, Patently Apple posted a report titled: “Industry Trends: 3D Chip Stacking Technology and the Revolutionary switch to Glass Substrates.” The report noted that the coming revolutionary switch  to glass substrates for chips between 2026 and 2030. AMD, Intel and Samsung were listed as the leaders in this shift to glass substrates with TSMC being secretive about their plans to make this industry shift. The video below was from our original report.

Today we’re learning in a new ETNews report that Samsung Electro-Mechanics has begun in earnest to build a glass substrate ecosystem, which is attracting attention as a next-generation semiconductor substrate.

According to industry sources this week, Samsung Electro-Mechanics held a seminar with glass substrate-related material, component, and equipment (small and medium-sized equipment) companies at its Suwon headquarters.

It was found that 27 domestic and foreign small and medium-sized equipment companies necessary for glass substrate manufacturing, such as processing, cutting, and inspection, participated in the event, with the purpose of sharing technological status and strengthening collaboration.

In particular, the seminar that day attracted attention as it was reported that not only Samsung Electronics but also people from Samsung Electronics' semiconductor division attended.

Samsung Electronics is preparing to manufacture glass substrates, and Samsung Electronics is planning to introduce glass substrates to next-generation semiconductor production.

Glass substrates are emerging as next-generation semiconductor substrates that are more heat-resistant and have a smooth surface than existing plastic materials, making it easy to implement microcircuits. The semiconductor industry is paying close attention to this substrate, which is optimized for the rapid increase in data processing due to the development of the artificial intelligence (AI) market.

For more on this, read the full report from ETNews

TSMC’s plan to enter this new market remains secretive.