As Apple’s M-Series processors gain power, the higher the heat could run in devices. For this reason, Apple has invented a new thermal module aimed at higher end devices like MacBook Pro, iPad Pro and various Mac desktops.

In Apple’s patent background they noted that thermal modules (e.g., heat pipe, vapor chamber) are used to transport heat (e.g., thermal energy) generated by a heat-generating component. When used in electronic devices, thermal modules can transport heat away from a heat-generating component (e.g., integrated circuit), thus allowing the heat-generating component to cool more rapidly.

Apple’s patent application covers a thermal module includes parts with diverging or divergent walls that cause a capillary pressure gradient in a bonding paste used to secure the parts together. Based in part on the capillary pressure, the bonding paste is drawn in between the divergent walls, including small gaps between the walls. Additionally, during a reflow operation of the bonding paste, particles and/or air bubbles can egress from the bonding paste, allowing the bonding paste to freeze and form a homogeneous structure.

By removing particles and air bubbles, the bonding paste can form a more robust structural joint and a hermetic seal for the thermal module. The multiple parts of the thermal module can be formed into their respective shapes prior to be joined together by the bonding paste. As a result, the formation of the thermal module is less likely to damage other structures, such as wick structures.

The bonding paste may be selected from copper paste or solder paste, as non-limiting examples. Accordingly, at room temperature the bonding paste is in a solid state, or solid form, and is converted to a liquid state, or liquid form, when heated to a temperature at or above the melting temperature of the bonding paste.

Beneficially, the bonding paste in liquid state incurs a force (e.g., capillary pressure) and is drawn, or forced, between a gap of the divergent walls, thus increasing the contact surface area between the bonding paste and the walls. The bonding paste in a solid state thereafter provides a structural joint and hermetic seal between the parts of the thermal module. Capillary forces cause the molten liquid to form a concave meniscus due to the divergence angle between the opposing walls, and the capillary pressure gradient draws the molten liquid toward the root of the divergence and, in combination with buoyancy forces, purges bubbles of lower-density fluids (e.g., air, flux) out of the molten body through the meniscus surface. Once the molten liquid freezes back into a solid state, the joint is formed of a non-porous solid that provides a hermetic seal between the two now-joined parts of the enclosure.

Apple’s patent FIG. 1 below illustrates a future MacBook (likely a MacBook Pro) with a new Thermal Module #120 could be a heat pipe or vapor chamber; FIGS. 11 and 12 illustrate an alternate example of a thermal module, showing a port used to receive a refrigerant (water, gas, vapor carrying thermal energy to a condensed region).

Apple illustrates that the new thermal module could apply to future iPads and Mac desktops – especially for devices using higher end M-chips over time.

To review the full technical aspects of this invention, review patent application 20240389269.