TSMC has reportedly begun trial production of 2nm chips in its Baoshan Plant in Hsinchu, northern Taiwan, with the schedule of mass producing 2nm in 2025 still on track. A report by Commercial Times reveals that the price of 2nm wafers is expected to double compared to 4/5nm, which may exceed USD 30,000 per wafer.  The first wave of 2nm chips will be adopted by smartphones and high-performance computing OEMs.

While the yield rates for advanced nodes of Intel and Samsung are rumored to be relatively low, the rising price of 2nm wafers reflects TSMC’s market monopoly as well as its strong pricing power, the report notes.

With 2nm set to debut in 2025, TSMC’s key suppliers are expected to see explosive profit growth, the report indicates. According to the report, Taiwanese IP firm M31, for example, has already developed IP that supports the 2nm platform for both smartphones and high-performance computing. Likewise, eMemory has disclosed that it is collaborating with leading foundries to develop 2nm.

Apple fans have their fingers crossed that mass production of 2nm chips for 2025 will translate to 2nm processors for iPhone 17.

In other TSCM news, Taiwan's Commercial Times reports that TSMC and Amkor expand Arizona advanced packaging collaboration. Amkor International Technology Co., Ltd. and TSMC announced today that they have signed a memorandum of cooperation to provide advanced packaging and testing services in Arizona and further expand the local semiconductor ecosystem.