Business Korea reports this morning that TSMC is set to receive the world’s first High Numerical Aperture (NA) Extreme Ultraviolet (EUV) lithography equipment, the 'EXE:5000,' from Dutch company ASML at the end of this month.  This move marks a significant milestone for TSMC, the world's leading foundry company, as it aims to enhance its capabilities in advanced process manufacturing.

Initially, TSMC was hesitant about the early adoption of High NA EUV due to its exorbitant cost and the complexities involved in production optimization. However, the rapid increase in demand for AI-oriented ultra-fine processes has prompted the company to revise its strategy. By securing next-generation EUV technology ahead of schedule, TSMC aims to maintain its technological edge in the highly competitive semiconductor industry.

The High NA EUV equipment, which increases the numerical aperture from 0.33 to 0.55, allows for higher resolution and more precise patterns on semiconductor wafers. This technology is crucial for the development of sub-2nm processes, which are essential for producing smaller, more powerful, and more efficient chips.

TSMC plans to adopt High NA EUV technology starting with its 1.4nm (A14) process, which is scheduled for mass production in 2027.

This strategic move positions TSMC to capitalize on the growing demand for advanced semiconductors driven by the AI boom. With Intel facing challenges in the foundry business, TSMC has a unique opportunity to solidify its leadership in the ultra-fine process competition. For more, read the full report by BusinessKorea.