In 2025 Google is Switching to TSMC's Fan-out (InFO) Packaging Technology to support AI in Hi-End Smartphones
TSMC's fan-out (InFO) packaging process will break Apple's dominance. The supply chain revealed that Google's (Google) mobile phone self-developed chip Tensor will switch to TSMC's 3nm process next year and will also begin to introduce InFO packaging, significantly reducing the thickness of the chip and improving Energy efficiency has become a key issue in the high-end AI mobile phone market.
China's Business Times reported that "The supply chain revealed that Google, which will switch to TSMC for production next year, will be equipped with the Tensor G5 chip in the Pixel 10 series. In addition to using 3 nanometers, it will also be packaged in an integrated fan-out type.
A major customer of TSMC has Spec-in (provides specification requirements), that is, using glass materials. In mid-July, Patently Apple posted a report on the future use glass materials titled "Industry Trends: 3D Chip Stacking Technology and the Revolutionary switch to Glass Substrates."
So far, chip progress has been achieved through smaller manufacturing processes. If new materials are used, more transistors can be placed on a single chip, which is the same as chip shrinkage. Taking Intel as an example, it predicts that by 2030, the use of glass substrates will allow one trillion transistors to be placed on a single chip, which is 50 times that of Apple's A17 Pro processor. In other words, glass substrates will become the next major event in chip development.