According to Deutsche Welle, TSMC's Europe's first wafer fab in Dresden, Germany, will start construction within a few weeks, basically in line with the timetable announced by TSMC last year. Earlier, TSMC said it would start construction in the fourth quarter of this year and target production in 2027.

In August last year (2023), TSMC announced a joint venture plan to build a German factory with a total investment of US$11 billion. In addition to TSMC, Infineon, NXP and Bosch each hold 10% equity. The project received a subsidy of 5 billion euros from the German government.

It is understood that TSMC’s German factory will initially use the 22nm process and mainly produce automotive microcontrollers. It may be expanded to produce more advanced chips in the future.

Paul de Bot, general manager of TSMC's European subsidiary, confirmed earlier at a seminar in the Netherlands that TSMC will start construction of a chip factory in Dresden, eastern Germany, in the fourth quarter of this year, with the goal of starting in 2027. put into production.

Deutsche Welle further reported that according to the plan, TSMC's new Dresden factory will initially provide 2,000 jobs. In order to ensure that the factory can be put into operation smoothly in 2027, the city of Dresden is spending 250 million euros to build an industrial-specific water supply system, which will filter water directly from the Elbe River and is completely independent of the existing drinking water pipe network.