In April, Patently Apple posted a report titledl "TSMC's President confirmed yesterday that their 2nm processor design that uses Nanosheet technology for the first time has been Finalized." The report noted that "TSMC pointed out that the product portfolio of the 2nm process will be quite similar to that of the 3nm process, which means that it will still be dominated by end applications such as smartphone applications and high-performance computing (HPC).'

Today, a new supply chain report from ETNews states that "Taiwanese semiconductor foundry TSMC will begin trial production next week ahead of mass production of the 2 nanometer (nm) process next year" that Apple will be adopting for its iPhone 17 and more.

According to today's Taiwan’s Liberty Times, TSMC will begin trial production of 2nm semiconductors at its Baoshan plant in the Hsinchu Science Park in northern Taiwan next week.

Liberty Times reported that equipment for 2nm production has been brought in and installed at the Baoshan plant since the second quarter, and trial production will begin in the third quarter, earlier than the fourth quarter expected by the market. It is interpreted that they are speeding up the process to secure a stable yield before mass production.

TSMC plans to apply gate all around (GAA) technology starting with the 2nm process, which is expected to improve performance and power efficiency. Mass production of 2nm is scheduled to begin next year, and TSMC also plans to introduce back-side power supply (BSPR) technology.

In the first half of 2024, 99% of the world's artificial intelligence (AI) semiconductors were produced by TSMC, and that in the second half of this year, more AI and high-performance computing (HPC) semiconductors are expected to be mass-produced using TSMC's 3 and 5 nm processes.