In January 2024, Patently Apple reported that "TSMC CEO Wayzer said that their 2nm process, which will be launched in 2025, will be the industry's most advanced semiconductor technology in terms of integration and energy efficiency."

Taiwan's Commercial Times reported yesterday that TSMC is confident about its 2-nm process, claiming it will secure more customers than the 3-nm process. TSMC's Vice President of process development, Zhang Xiaogang, stated at a forum on May 23rd that “the development of the 2-nm process is progressing smoothly” and that “mass production should be possible around 2025 as planned.” This dismisses speculations that “TSMC would delay the full-scale mass production of the 2-nm process until 2026 due to technical issues.”

The rumors about TSMC delaying its 2-nm process arose from its first-time application of a current control technology called “Gate-All-Around (GAA).” Vice President Zhang explained that “the yield [the ratio of good products to the total produced] when applying GAA has reached 90% of the target.”

Wei Zhejia, TSMC’s CEO, expressed confidence, saying, “The demand for the 2-nm process will exceed that for the 3-nm and 5-nm processes.” A TSMC official stated, “We plan to triple the 3-nm process production capacity by the end of the year,” adding, “Even then, we won’t be able to fulfill all customer orders.” Business Korea.

To steal some of TSMC's thunder, both Samsung and Intel are planning to deliver 1.4nm chips by 2027.