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Samsung's Biometric Financial Card Patent covering an integrated Fingerprint Sensor was published last week

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In June 2023 Samsung introduced their Biometric Financial Card to better compete with Apple Card that was introduced in 2019. The all-in-one security solution offers biometric cards a variety of things they need to make everyday transactions safer and more convenient. This new fingerprint security chip was selected as a winner of the CES 2023 Best of Innovation Awards in the Cybersecurity & Personal Privacy category. No more PIN or signature. See the promotional video below. 

Last week the U.S. Patent Office published Samsung's patent application that was originally filed in July 2023 in the U.S. and one year earlier in South Korea.

Samsung's patent application covers a fingerprint sensor package includes a package substrate including a cavity; a sensing substrate on the package substrate, the sensing substrate comprising a first surface and a second surface which are opposite to each other; a controller chip on the first surface of the sensing substrate; and a molding layer on the controller chip and the first surface of the sensing substrate, wherein the second surface of the sensing substrate is exposed by the cavity.

Further, a fingerprint sensor package includes a core dielectric layer having a first surface and a second surface opposite to each other, the core dielectric layer comprising a cavity which penetrates from the first surface toward the second surface; a sensing substrate on the first surface of the core dielectric layer; a ground bezel on the second surface of the core dielectric layer; an adhesion layer between the core dielectric layer and the sensing substrate; a controller chip on the sensing substrate; and a molding layer on the controller chip, the sensing substrate, and the first surface of the core dielectric layer, wherein the cavity vertically overlaps the sensing substrate.

Overall, a smart card includes a main body comprising a groove region and a connection pad; a security chip in the main body; and a fingerprint sensor package configured to sense a fingerprint and to transmit a sensing result to the security chip, wherein the fingerprint sensor package includes: a package substrate which comprises a core dielectric layer comprising a cavity, a first bonding pad on a top surface of the core dielectric layer, and an external connection pad on an edge of the top surface; a sensing substrate on the top surface, wherein the sensing substrate comprises a sensing region on which sensing patterns are provided and a peripheral region on which a second bonding pad is provided, the peripheral region surrounding the sensing region; a conductive wire extending between the first bonding pad and the second bonding pad, and connecting the first bonding pad to the second bonding pad; a controller chip on the sensing substrate; and a molding layer on the sensing substrate and the top surface, wherein the molding layer is disposed on the sensing substrate and the first bonding pad and exposes the external connection pad, wherein the external connection pad of the package substrate is coupled to the connection pad of the main body, wherein the cavity has a first width in a first direction, wherein the sensing substrate has a second width in the first direction, and wherein the second width is greater than the first width.

Samsung's patent  Referring to FIG. 1 below covers a smart card that may include a fingerprint sensor package #10, a security chip #11, and a display unit #12. The smart card may further include a memory device for storing information which may be displayed on a credit card or check card, such as a card number, an expiration date, and a name of a user. The smart card 1 may further include a radio-frequency (RF) chip. The fingerprint sensor package may recognize a touched fingerprint when the user brings a fingerprint of the user into contact with a fingerprint sensor. The fingerprint sensor package may compare recognized fingerprints with registered fingerprints to determine whether the recognized fingerprints match the registered fingerprints.

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Samsung's patent FIG. 2 above illustrates a simplified bottom view showing a layout of some components of a fingerprint sensor package according to some embodiments;

In Samsung's patent FIG. 9 above, the fingerprint sensor package #30 may further include an inner molding layer #360 that covers the controller chip #310. The inner molding layer may be interposed between the molding layer #350 and the controller chip. An interface may be disposed between the inner molding layer  and the molding layer.

For more details, review Samsung's full U.S. patent application 20240169756.

10.0x35 Patently Mobile