TSMC's President confirmed yesterday that their 2nm processor design that uses Nanosheet technology for the first time has been Finalized
According to a new supply chain report this morning, demand for the 3nm process is quite strong driven by major customers such as Apple, Intel, Qualcomm and MediaTek. TSMC is more optimistic about the demand for the 2nm process. President Wei Zhejia pointed out on Thursday that the new 2nm design has been finalized. The case volume performance of (tape out) is stronger than that of 3nm and 5nm, and it is expected to be mass-produced in 2025.
According to the United Daily News report, Wei Zhejia further noted that that judging from the current status of customer design finalization, the demand for 2-nanometer is better than that of advanced processes such as 3-nanometer and 5-nanometer, and almost all AI-related companies have cooperated with TSMC. The company is optimistic that the contribution of 2nm in the future is expected to be higher than that of 3nm.
TSMC pointed out that the product portfolio of the 2nm process will be quite similar to that of the 3nm process, which means that it will still be dominated by end applications such as smartphone applications and high-performance computing (HPC).
TSMC’s expected 2nm process will introduce Nanosheet structure for the first time and will have the best density and energy efficiency in the semiconductor industry. Nanosheet structure is different from the FinFET process that has been used for many years.
Lastly, the report notes that while TSMC's 2nm chips will have at least 30 exposed layers, which is significantly more than 3nm, the production cycle of 2nm is much longer than that of 3nm. The Initial yield rate of 2nm won't be high.
Due to the lower yields for 2nm, it's unknown at this time whether Apple will initially restrict 2nm chips to their top iPhone Pro Max model.
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