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Apple may adopt Resin Coated Copper (RCC) in iPhone 17 Pro Max Motherboards to make them Lighter and more

10.0z22 cover (Ming-Chi Kuo)

According to the latest research notes from Apple analyst Ming-Chi Kuo, Apple may adopt RCC for iPhone 17 to reduce the thickness of the mainboard to reduce on internal space and make the drilling process easier because it’s fiberglass-free.

However, RCC will not be adopted in the 2024 iPhone 16 due to its fragile characteristics and inability to pass drop tests at present.

Currently, Ajinomoto is the leading supplier of RCC material. If Apple and Ajinomoto can improve the RCC material before 3Q24, the 2025 new high-end iPhone 17 models will use it.

Resin Coated Copper (RCC) is the combination material of a layer of uncured B-stage resin and a layer of copper foil, which is a unique dielectric material for building multilayer circuitry especially in HDI printed circuit boards (PCBs).

10.X - Research notes & Rumors from Ming-Chi Kuo


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