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Ming-Chi Kuo: The iPhone 15 Pro Overheating issues aren't related to TSMC'S 3nm node

10.0z22 cover (Ming-Chi Kuo)

Late this morning, Apple analyst Ming-Chi Kuo posted a new research note as follows:

"My survey indicates that the iPhone 15 Pro series overheating issues are unrelated to TSMC’s advanced 3nm node. The primary cause is more likely the compromises made in the thermal system design to achieve a lighter weight, such as the reduced heat dissipation area and the use of a titanium frame, which negatively impacts thermal efficiency. It’s expected that Apple will address this through software updates, but improvements may be limited unless Apple lowers processor performance. If Apple does not properly address this issue, it could negatively impact shipments over the product life cycle of the iPhone 15 Pro series."

Coincidentally, Patently Apple posted a patent report earlier today about future liquid cooling and heat issues with the iPhone 15 Pro Max. 

10.X - Research notes & Rumors from Ming-Chi Kuo


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