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Apple supplier LG Innotek is scheduled to begin high-volume production of flip chip ball grid array (FC-BGA) for M-Series chips in Q4 for new Macs

1 cover M3 iMac

A year ago, Patently Apple posted a report titled "Apple Supplier LG Innotek plans to produce High-End Flip-Chips in 2023 likely aimed for Apple's M-Series Processors." The report noted that Samsung was Apple's leading supplier for flip chips (FC-BGA) today, Apple supplier LG Innotek was entering this high-end semiconductor board market. LG will spend US$347 million on new equipment that could begin production in 2023.

Today, Korea's tech site The Elec is reporting that LG Innotek is planning to start production of flip chip ball grid array (FC-BGA) in March and high-volume manufacturing in October.

LG Innotek expects its FC-BGA production capacity to reach 7.3 million units per month in Q4 2023 and 15 million units per month in 2026.

LG Innotek's new roadmap is more detailed than what they disclosed last month when it said its new FC-BGA factory, likely referring to F1, to start mass production during the second half of the year. For more details, read the full report by The Elec.

Mark Gurman has predicted M3 based Macs are likely to arrive in Q4 and this is in line with LG Innotek's "high-volume" production schedule of flip chip ball grid array (FC-BGA) used in Apple's M-Series processors.

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