In February 2022, Patently Apple posted a report titled "Apple Supplier LG Innotek plans to produce High-End Flip-Chips in 2023 likely aimed for Apple's M-Series Processors." Today LG Innotek announced that it plans to start full-scale operation of its new factory for flip chip (FC)-ball grid array (BGA), a high value-added semiconductor substrate, in the second half of the year. FC-BGA is a new business for LG Innotek.

The Elec is reporting that LG Innotek held a facility introduction ceremony at its new FC-BGA plant in Gumi, Gyeongsangbuk-do, attended by President Jeong Chul-dong and others. LG Innotek is building an FC-BGA production line in Gumi Plant 4, which was acquired from LG Electronics in June last year and has a total floor area of ​​220,000 square meters.

The FC-BGA new plant plans to have a mass production system by the first half of the year and start full-scale mass production in the second half. This place will be built as a smart factory that integrates the latest digital transformation technologies such as artificial intelligence (AI), robots, unmanned, and intelligent.

If mass production of the new plant starts in earnest, it will be possible to speed up the development of FC-BGA for PCs and servers as well as FC-BGAs for networks/modems and digital TVs.