Back on January 23 Patently Apple posted a report titled "Apple is already engaged with TSMC's 5nm Processor Team to Prepare for a 5nm iPhone in 2020." TSMC's 5nm processor will advance AR, AI Deep Learning and provide power for days. Days later TSMC broke ground on their 5nm plant. Today TSMC has provided yet another update on its 5nm roadmap.

Earlier today TSMC announced delivery of the complete version of its 5nm design infrastructure within the Open Innovation Platform (OIP). This full release enables 5nm systems-on-chip (SoC) designs in next-generation advanced mobile and high-performance computing (HPC) applications, targeting high-growth 5G and artificial intelligence markets.

TSMC's 5nm process is already in risk production and offers IC designers a new level of performance and power optimization targeted at the next generation of high-end mobile and HPC applications.

Compared with TSMC's 7nm process, its innovative scaling features deliver 1.8X logic density and 15% speed gain on an ARM Cortex-A72 core, along with superior SRAM and analog area reduction enabled by the process architecture, TSMC said.

The 5nm process enjoys the benefits of process simplification provided by EUV lithography, and is making excellent progress in yield learning, achieving the best technology maturity at the same corresponding stage as compared to TSMC's previous nodes.

Cliff Hou, VP of R&D and technology development at TSMC:  "TSMC's 5-nanometer technology offers our customers the industry's most advanced logic process to address the exponentially growing demand for computing power driven by AI and 5G.  As always, we are committed to helping customers achieve first-time silicon success and faster time-to-market."

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