An interesting rumor has surfaced this morning that claims that Apple is working on a backside camera with a 3D sensor for 2019 to further promote their push into Augmented Reality.

According to a new Bloomberg report, the new camera would use an alternative method of 3D depth mapping. Apple's current the iPhone X uses a dot projector methodology. The proposed 2019 backside camera would use a 3D mapping methodology utilizing a laser which Patently Apple covered in a patent application report posted back in June. One of the patent images is noted below.

Apple noted in their patent filing that "The system also comprises a light source, such as a laser #22, which is driven by a laser driver to direct a light beam through a DOE which typically comprises a diffractive lens. In our report we also noted that one of the inventors of the patent Jawad Nawasra is also credited with another 3D mapping app titled Time-of-flight depth mapping with flexible scan pattern.

The Bloomberg report further noted that "The planned rear-facing sensor would instead use a time-of-flight approach that calculates the time it takes for a laser to bounce off surrounding objects to create a three-dimensional picture of the environment."

While noting that Apple has been in discussions with suppliers such as manufacturing Infineon Technologies AG, Sony Corp., STMicroelectronics NV and Panasonic Corp about time-of-flight sensors, the report claims that it's still in an experimental stage. The project is not a guarantee if the system doesn't deliver as expected. You could read the full Bloomberg report here.

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