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China's Largest Semiconductor Packaging Provider has Reportedly Gained SiP Module Orders from Apple

10. 7A YAPYAP

 

A new supply chain report today claims that Jiangsu Changjiang Electronics Technology (JCET), China's largest semiconductor packaging and test services provider, has reportedly grabbed assembly orders for SiP (system-in-package) modules from Apple for 2016. JCET will be a new contract provider of SiP assembly services for Apple, adding to the existing suppliers including Japan's Murata and Universal Scientific Industrial (USI) of Taiwan-based Advanced Semiconductor Engineering (ASE), according to industry sources. STATS ChipPAC, which was acquired by JCET earlier in 2015, already has its Korea-based operation obtain certification from Apple.

 

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