On May 17, 2012, the US Patent & Trademark Office published a patent application from Apple revealing a new manufacturing process. The main focus of this particular invention concerns the creation of devices with a unitary housing without seams or gaps. In March of this year we learned of Apple's use of ultrasonic welding in context with fastening parts within devices such as the iPhone. Today we learn of ultrasonic welding being used in conjunction with metal foil so as to create seamless form factors. It's the kind of stuff that keeps Sir Ive giggling in his sleep.