Supply chain news out of Taiwan today states that Amkor Technology and STATS ChipPAC have each obtained 40% of the total packaging orders placed by Apple for its next-generation A8 processor, with the remaining 20% will be taken over by Advanced Semiconductor Engineering (ASE).
Apple's A8 chip will use a new package-on-package (PoP) SoC solution comprising processors and mobile DRAM in a single package, said the sources.
Taiwan Semiconductor Manufacturing Company (TSMC), which is believed to have landed foundry orders for Apple's next-generation A8 chip, has also secured wafer bumping orders for the processor as part of its turnkey solution, the sources indicated.
TSMC reportedly will start ramping up production using 20nm process technology for Apple's A8 chip in the second quarter of 2014.
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